Bridge-Driver IC Supports Automotive Brushed DC Motors, Solenoids



Features of the New Bridge Driver

Going well beyond a bare-bones driver, these devices offer voltage monitoring and load diagnostics as well as protection features against overcurrent and overtemperature, with fault conditions indicated on a package pin. A low-power sleep mode offers quiescent current of 1.3 µA.

Among the other attributes of these drivers, which are AEC-Q100-qualified for automotive applications (temperature grade 1: –40 to +125°C), are:

4.5- to 35-V operating range
Support of 3.3- and 5-V logic inputs
RON_LS + RON_HS = 250 mΩ in the QFN package
Maximum IOUT = 6 A (QFN package)
PWM frequency operation up to 25 kHz with automatic dead-time assertion
Configurable slew rate and spread-spectrum clocking for low EMI.
Integrated current sense, eliminating the need for a separate shunt resistor
Proportional load-current output 
Configurable current regulation
Numerous protection and diagnostic features with configurable fault reaction (either latched or retry), including load diagnostics in both the off-state and on-state to detect open load and short circuit; supply-voltage monitoring; overcurrent protection; and overtemperature protection

The devices come in three functional variants: hardwired interface: HW (H), and two SPI interface variants, namely SPI(P) and SPI(S), with SPI (P) for externally supplied logic supply and SPI (S) for internally generated logic supply. The SPI interface variants offer more flexibility in device configuration and fault observability.

The devices are offered in a 3.5- × 4.5-mm, 20-lead QFN package as well as other package options. The comprehensive 70-page datasheet includes full details on setup, waveforms, timing, and other critical design-in information.

Although TI doesn’t have an evaluation module for these drivers, the datasheet shows a layout example for a 4 cm × 4 cm × 1.6 mm, 4-layer PCB for a leaded-package device, using 2-oz. copper on top and bottom signal layers and 1-oz. copper on internal supply layers (Fig. 2).



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