All About Circuits Looks Ahead at Embedded World 2024


Embedded World 2024 starts next week, April 9-11 in Nuremberg, Germany, and I’m excited to be attending! The event will be packed with interesting embedded technology, more than anyone could digest during a three-day event. With that in mind, in this newsletter we’re sharing the highlights from a few select companies that have told us what they’ll be showcasing at this year’s event.

I hope to see you at the show. If you see me roaming the halls, checking out exciting new technology and products, please stop me and say “Hi.”

And please come by the All About Circuits booth—Hall 5, Booth 314.

– Jeff Child, Editor-in-Chief for All About Circuits

 

 

NXP to Feature 19 Demos Across Automotive, Industrial, Mobile, and More

NXP to Feature 19 Demos Across Automotive, Industrial, Mobile, and More

NXP says its theme for Embedded World this year is “smart edge advancements that redefine how devices anticipate and automate to make the connected world better, safer, and more secure.”  Along those lines, the company plans to provide no less than 19 demos at its booth, ranging in application areas such as automotive, industrial, smart home, mobile, and more.

The booth demos will leverage processors, MCUs, and other ICs across NXP’s entire product line, including i.MX 95, i.MX 8XL, S32M2, MCX N, and many more. The company will also showcase its FRDM Lab that lets users explore different MCX demos and get started with NXP’s MCUXpresso Developer Experience. Users can interact with over 40 virtual, application-focus areas and try out FRDM boards and shields.

Meanwhile, NXP says to you can expect to see demos based on NXP technologies—43 demos in fact—at the Embedded World booths of its partners, including Arrow, Avnet Silica, EBV, Embedded Wizard, iWave, U-blox, and others.

There will be seven NXP sessions as part of this year’s Embedded World conference program, ranging on topics from RISC-V to machine learning to software-defined vehicles. Here’s a sampling of titles from those sessions: “A Bridge to the Future – How Matter Brings Compatibility with Zigbee Networks,” “Unlocking Extensible RISC-V Cores Using the Core-V Extension Interface (CV-X-IF),” and “A MIPI DSI/CSI-2/D-PHY Deep Dive.”

Come see NXP at Embedded World at Hall 4A, Booth 222.

 

Arm to Showcase Technology for an AI-Accelerated Future Built on Arm

Arm to Showcase Technology for an AI-Accelerated Future Built on Arm

At Embedded World, Arm will showcase its power-efficient compute platforms aimed at the future of edge AI. The company says it is leveraging software solutions and standards that remove the friction from deployment, and is working with a global ecosystem of over 1,000 Arm partners.

Arm has a packed agenda for the show, including a SOAFEE Reception, partner “Lightning Talk” sessions, an Arm Developer Program meetup, Developer Workshops, and more.

On the show floor, Arm is featuring a number of demos. In its IoT demos, Arm and its ecosystem partners will showcase edge AI in action. From power efficient microcontrollers to higher-performance IoT devices, visitors can see the rate of innovation in edge AI devices built on Arm, says the company.

In its automotive demos at the show, Arm says visitors can see how Arm Automotive Enhanced compute platforms accelerate software development and improve time-to-market for AI-driven vehicles of the future. This will include a series of partner demos leveraging the SOAFEE architecture.

Arm reminds us that its partners will be using the “Built on Arm” logo wherever they are using Arm technology. So, keep an eye out as you walk the show floors. Arm solutions are everywhere at EW24, says the company.

Throughout the week of the Embedded World conference, there are no fewer than 17 sessions led by Arm experts, including both conference sessions and in the exhibitor forum. Here’s a sampling of titles from that list of sessions: “A Glance into 2027 Software-Defined Vehicles: Introducing Next-generation Arm Solutions for Automotive,” “Home, Sustainable, Secure, Smart, and Sweet Home,” and “How CMSIS Accelerates Productivity.”

Check out Arm’s Embedded World offerings at Hall 4, Booth 504

 

Congatec to Unveil Several COM Boards at Embedded World

Congatec to Unveil Several COM Boards at Embedded World

Congatec has announced that it plans to roll out a slew of new Computer-on-Module (COM) boards at this year’s Embedded World event. The offering will include COMs based on Intel Core Ultra processors with integrated AI, along with ones based on low-power and high-performance x86 processor technology. According to the company, these products will feature increased performance, energy efficiency, and integrated advanced IIoT- and security functions—all of which have not been part of any existing COM offerings before now.

The form factors of these new boards are expected to include those in Congatec’s existing range, including COM Express, COM-HPC, SMARC, and Qseven-based modules. The company says that functions such module-integrated hypervisor technology and IIoT functionality makes it easier for embedded engineers to add functionalities without having to develop or integrate them themselves.

To support the new modules, Congatec offers its ecosystem, which includes sophisticated cooling solutions optimized for the individual modules, and carrier boards for easy evaluation and application design. Also provided are software support and individual integration services, along with the company’s testing and design services.

Visit Congatec at Embedded World at Hall 3, Booth 241.

 

TI to Showcase MCUs, Power Conversion, and AI-based Smart Displays

TI to Showcase MCUs, Power Conversion, and AI-based Smart Displays

For its part, Texas Instruments (TI) says it plans to showcase new embedded processing and connectivity products at Embedded World. TI says these products are aimed at enabling a safer, smarter and more sustainable future. At the show, the company will also showcase its latest advancements in application areas such as robotics, energy transition, and electric vehicles.

TI will showcase technologies across several product categories:

Smart multi-display HMI systems: TI will demonstrate how new embedded Arm-based processors with integrated AI accelerators enhance computing performance and can run up to three displays simultaneously for even the most complex HMI systems, supported by a unified software platform for maximum reuse.
Microcontrollers (MCUs): The company says it has added more 100 new MCUs to its portfolio of Arm Cortex-M0+ MCUs since their introduction at Embedded World 2023. The MCUs feature options to match any design requirement for memory, analog integration or size, reducing cost and design time at both the component and system level, says TI.
Robotics:  TI plans to demo the use of integrated embedded processors like the TDA4VM in the mobile robot safety controller (MRSC) of Amazon Robotics’ Proteus autonomous mobile robots (AMRs). The exhibit is intended to showcase the importance of innovative semiconductors in safety systems for next-generation AMR applications.
Power conversion and control for energy systems: TI will display a bidirectional GaN-based solar microinverter that uses wireless connectivity to monitor the voltage of each inverter and rapid shutdown procedures through an Internet Protocol v6-based Sub-1 GHz wireless network. The demo will also show how to commission a microinverter through Bluetooth LE energy using a smartphone, all on a single dual-band device. Also on display will be a tested and ready-to-use reference design for variable-frequency air conditioner outdoor unit controllers in heating, ventilation, and air-conditioning (HVAC) applications. It makes use of TI’s C2000 MCU.

TI experts will present in 10 technical sessions at the conference, in areas such as connectivity technology for industrial control, energy management, health care, and millimeter-wave radar sensing for robotics.

Meet with Texas Instruments at Embedded World at Hall 3A, Booth 131.

 

Codasip to Demo Its CHERI Memory Protection Technology

Codasip to Demo Its CHERI Memory Protection Technology

Codasip has announced that it will demonstrate its CHERI memory protection and HW/SW co-optimization at Embedded World. The technologies are enabled by Codasip’s Custom Compute offering combining the Codasip Studio design automation tools with a range of customizable RISC-V processor IP.

The CHERI technology, invented at Cambridge University and brought to commercial implementations by Codasip, is said to actively prevent the most common cyberattacks with the potential of eliminating approximately 70 percent of vulnerabilities documented in the Common Vulnerabilities and Exposures (CVE) program. Last Fall, Codasip announced that it added built-in fine-grained memory protection to its 700 processor family by extending the RISC-V ISA with CHERI-based custom instructions.

At the show, the company will also show how to profile an embedded application to identify bottlenecks in the code and how custom instructions can be easily added to optimize the hardware to improve the application’s performance. Codasip says some examples of the potential gains from HW/SW co-optimization include: 2x performance gain running the SHA512 cryptographic hash algorithm; and 2.5x speedup and 30% reduction in power consumption for AI/ML workloads.

As part of the embedded world conference program, Codasip’s CTO Zdenek Prikryl will present the session “Customized RISC-V in a simple game console.”

Come and see Codasip at Embedded World at Hall 4, Booth 368.

 

EW24 Quick Briefs

Tasking will present its latest tools for the development of high-performance, safe, and secure embedded automotive software Hall 4, Booth 255. They will showcase tools that span the complete software development process, known as “Compile, Debug, Analyze.”

Onsemi will showcase its intelligent power and sensing solutions for automotive and industrial markets at Hall 4A, Booth 260. Experts will be on hand to discuss and help you support your application and design challenges, says the company.

Weebit Nano will demonstrate its embedded ReRAM module on the advanced 22 nm fully depleted silicon on insulator (FD-SOI) process at Hall 4, Booth 658. Weebit’s VP of R&D Ilan Sever will deliver a presentation, “Smart Memory Partitioning Enhances System Performance.”

Nexcom will be at Hall 5, Booth 253 to showcase embedded computing products in six vertical market pavilions, including 5G Edge, Manufacturing X, Transportation AI, Smart Edge · Smart City, Software-Defined Edge Computing, and OT Cybersecurity.

 

All images used courtesy of their respective companies



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