Multi-Die Systems Set the Stage for Innovation


Some companies, such as AMD, Intel, and NVIDIA, are delivering systems using multi-die technology, usually on high-end platforms that utilize chiplets like high bandwidth memory (HBM). Or they’re tying together different chip technologies like SERDES and analog to high-performance compute systems like FPGAs.

Much of the existing multi-die solutions have been custom, for example, Intel’s Embedded Multi-Die Interconnect Bridge (EMIB). However, standards like Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project’s Bunch of Wires PHY specification are opening up chiplet technology to a wider array of companies and developers. Though the concept of a “chiplet app store” is still a long way away, the availability of more standards-based chiplets is closer at hand.

The chiplet and multi-die system market is ramping up (Fig. 2), with a significant portion dominated by server/AI applications being driven by hyperscalers. Automotive represents a sizable chunk, as the approach allows for mixing of chiplet technology in an area where chip customization has significant benefits.



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